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    IRIS – RFIC Passive Extraction
    iModeler – Passive PDK Model Generation
    iVerifier – Passive PDK Verification
    Package Solution
    HERMES 3D – 3D EM Simulation for Package and Board Designs
    Metis – Fast EM Simulation for Advanced 2.5D/3D Packaging
    HSD Solution
    ViaExpert – Via Modeling and Simulation
    SnpExpert – S-parameter Exploration
    CableExpert – Fast and Accurate Cable Modeling and Simulation
    TmlExpert – TML Modeling & Simulation
    ChannelExpert – Channel Exploration
    Heracles – Automated SI Signoff for High Speed Design
    Hermes PSI - PI/SI Analysis Platform
    XDS – Xpeedic RF Design and Simulation Platform
    Cloud Solution
    JobQueue – Simulation Job Queue System
    LibManager – Library Management Platform
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  • Hermes 3D:3D Full-Wave Electromagnetic Simulation of Package and Board 2022-05-06
  • Experiment and Simulation Studies on Resonances due to Period Structure in PCBs 2022-04-21
  • High-Speed Digital SI/PI Simulation Platform 2022-04-21
  • A Complete EM Simulation Suite for On-Chip Passives in Advanced Nodes 2022-04-21
  • RF PCB EM-Circuit Co-simulation Platform 2022-04-21
  • Xpeedic On-Chip Passives EM Simulation Suite Certified for Samsung Foundry 8LPP Process Technology 2021-05-13
  • XDS – Xpeedic RF Design and Simulation Platform 2020-12-22
  • CableExpert: Fast and Accurate Cable Modeling and Simulation 2020-08-24
  • JobQueue – Simulation Job Queue System 2020-05-11
  • Metis – Fast EM Simulation for Advanced 2.5D/3D Packaging 2020-05-11

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  • HPC IC IMS IoT IPD mmWave
  • RF SI Simulation SiP Advanced Packaging
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