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Fast EM Simulation for Advanced 2.5D/3D Packaging
RF Design and Simulation Platform
PI/SI/Thermal Analysis Platform
Application Solution

12 Major Scenarios Comprehensively Accelerate Electronic System Design

  • Signal Integrity
  • Power Integrity
  • Electromagnetic
    Compatibility
  • Electro-Thermal
    Analysis
  • Stress and Reliability
  • 3DIC Chiplet 
  • Radio Frequency
    System 
  • Planar Antenna 
  • Power 
    Semiconductor
    Device
  • Power Delivery
    System 
  • Package Substrate 
  • PCB Board 
Industry Solutions

Communication
Infrastructure

Improve the system performance

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Data
Center

Realize high-performance computing & storage

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IoT

Enhance the ubiquitous interconnections

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New
Energy

Accelerate the green development

More

Automotive
Electronics

Enable the intelligence and safety

More

Industrial
Equipment

Build the intelligent system

More

Smart
Terminals

Enable high-speed digital experience

More

Communication Infrastructure

Improve the system performance

More

Data Center

Realize high-performance computing & storage

More

IoT

Enhance the ubiquitous interconnections

More

Automotive Electronics

Enable the intelligence and safety

More

New Energy

Accelerate the green development

More

Industrial Equipment

Build the intelligent system

More

Smart Terminals

Enable high-speed digital experience

More
News
More
Events
More
Resources
More