• Date: Mar 14-16, 2016.

• Location: Shanghai, China

• Booth: E06

In 2016, UBM and IEEE join forces to launch Tech Shanghai, where engineers will find the latest developments in the electronics industry, from highly automated driving, Industry 4.0 to the Internet of Things. Tech Shanghai combines UBM's 20 years of experience in organizing China's foremost technical events for electronic engineers and IEEE's expertise in hosting the world's largest and most respected microwave symposium since 1957.

Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic's silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic's EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.