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    IRIS – RFIC Passive Extraction
    iModeler – Passive PDK Model Generation
    iVerifier – Passive PDK Verification
    Package Solution
    HERMES 3D – 3D EM Simulation for Package and Board Designs
    Metis – Fast EM Simulation for Advanced 2.5D/3D Packaging
    HSD Solution
    ViaExpert – Via Modeling and Simulation
    SnpExpert – S-parameter Exploration
    CableExpert – Fast and Accurate Cable Modeling and Simulation
    TmlExpert – TML Modeling & Simulation
    ChannelExpert – Channel Exploration
    Heracles – Automated SI Signoff for High Speed Design
    Hermes PSI - PI/SI Analysis Platform
    XDS – Xpeedic RF Design and Simulation Platform
    Cloud Solution
    JobQueue – Simulation Job Queue System
    LibManager – Library Management Platform
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  • 3DIC第三讲——3DIC先进封装的信号完整性解决方案 2022-05-11
  • 3DIC第二讲——3DIC先进封装设计全流程EDA解决方案 2022-05-11
  • 3DIC第一讲——3DIC先进封装的发展趋势和对EDA的挑战 2022-05-07
  • Hermes 3D:3D Full-Wave Electromagnetic Simulation of Package and Board 2022-05-06
  • Xpeedic Logo 2022-04-24
  • Xpeedic Logo 2022-04-24
  • “行业领袖看2022”之芯和半导体VP:2.5D/3D IC先进封装设计将未来五年的爆点 2022-04-21
  • 芯和半导体:3DIC EDA成为ICCAD最亮的风景之一 2022-04-21
  • 2.5D/3D IC Advanced Packaging Analysis Platform 2022-04-21
  • Xpeedic Releases Hermes PSI at DesignCon 2022 2022-04-21

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